Xiaomi has officially showcased the Xiaomi 18 Fold at IFA 2026 in Berlin, providing the first physical look at the upcoming wide-aspect foldable smartphone ahead of its scheduled release. В Beyond the in-house system-on-chip, the hardware integrates high-performance memory architecture.
Xiaomi has officially showcased the Xiaomi 18 Fold at IFA 2026 in Berlin, providing the first physical look at the upcoming wide-aspect foldable smartphone ahead of its scheduled release.
Xiaomi confirmed that the foldable incorporates next-generation LPDDR6 RAM developed by ChangXin Memory Technologies (CXMT), which reaches data transfer speeds of up to 12,800 Mbps to accelerate...
В Beyond the in-house system-on-chip, the hardware integrates high-performance memory architecture.
The page is ready to read now. The fuller skim-friendly version will appear here automatically.
Xiaomi has officially showcased the Xiaomi 18 Fold at IFA 2026 in Berlin, providing the first physical look at the upcoming wide-aspect foldable smartphone ahead of its scheduled release.  Beyond the in-house system-on-chip, the hardware integrates high-performance memory architecture. Displayed in an exclusive cherry red finish, the flagship marks a pivotal strategic milestone as Xiaomi’s first commercial smartphone powered by its proprietary XRing O3 processor, underscoring the brand's expanding push into custom silicon development.
Displayed in an exclusive cherry red finish, the flagship marks a pivotal strategic milestone as Xiaomi’s first commercial smartphone powered by its proprietary XRing O3 processor, underscoring the brand's expanding push into custom silicon development.
Open the app view to save this story, compare related coverage, and continue from the same source.