New manufacturing platforms address high-aspect-ratio etching, advanced memory deposition, metal films, and silicon-carbide epitaxy for next-generation semiconductor production. Semiconductor equipment maker AMEC (Advanced Micro-Fabrication Equipment Inc.
New manufacturing platforms address high-aspect-ratio etching, advanced memory deposition, metal films, and silicon-carbide epitaxy for next-generation semiconductor production.
Semiconductor equipment maker AMEC (Advanced Micro-Fabrication Equipment Inc.
China) introduced six new high-end semiconductor manufacturing systems covering etching, thin-film deposition and silicon-carbide epitaxy.
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New manufacturing platforms address high-aspect-ratio etching, advanced memory deposition, metal films, and silicon-carbide epitaxy for next-generation semiconductor production. Semiconductor equipment maker AMEC (Advanced Micro-Fabrication Equipment Inc. China) introduced six new high-end semiconductor manufacturing systems covering etching, thin-film deposition and silicon-carbide epitaxy.
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