The race to build larger AI models has created a less glamorous but increasingly urgent problem: how to move heat and power through ever-denser chip packages without driving up cost, energy use and complexity. A Malaysian startup now wants to solve part of that problem at the material boundary level.
The race to build larger AI models has created a less glamorous but increasingly urgent problem: how to move heat and power through ever-denser chip packages without driving up cost, energy use and complexity.
A Malaysian startup now wants to solve part of that problem at the material boundary level.
The page is ready to read now. The fuller skim-friendly version will appear here automatically.
The race to build larger AI models has created a less glamorous but increasingly urgent problem: how to move heat and power through ever-denser chip packages without driving up cost, energy use and complexity. A Malaysian startup now wants to solve part of that problem at the material boundary level. Kuala Lumpur-based nanoSkunkWorkX (nSWX) has […]
Open the app view to save this story, compare related coverage, and continue from the same source.