# Why this matters
Edge AI projects commonly stall not because the model is weak but because the surrounding system doesn't match the assumptions made during development. Problems often appear at discipline handoffs: the sensor choice predates model profiling, firmware delivers frames unlike the training set, or a model that looks good on a workstation fails after quantization on the target chip.
# Where edge AI programs break
- Model vs compute platform: Chip constraints limit model design and the model sets chip requirements. Decisions are interdependent and should be made together. If different vendors own each side, integration can force costly platform changes late in the schedule.
- Firmware vs inference: Frame timing, exposure, ISP tuning, dropped packets, and sync issues change the model's input distribution. That looks like accuracy loss, but retraining may be the wrong response. Fixing the data pipeline requires someone fluent in both firmware and model diagnostics.
- Lab testing vs production: Bench success can fail thermal soak, RF, or EMC testing. Discovering these issues late drives expensive revisions. Real test infrastructure and early physical validation reduce this risk.
# What to check before shortlisting vendors
Decide which of the three boundaries your project crosses and use concrete filters:
- Stack coverage: Ask which layers the vendor delivers in-house — sensor and PCB selection, firmware, model development, and cloud. Any layer they don't cover becomes coordination work for you.
- Physical validation: Ask where and under what conditions devices are tested. Optical, RF, and EMC test access matters.
- Post-launch ownership: Ask how many models the vendor has updated on deployed fleets and what rollback and update procedures look like.
# Quick vendor comparison
The vendors are ordered by how much of the stack they cover and what makes each distinct:
- ByteSnap Design — combined hardware and software in a small team with an in-house EMC chamber for early prequalification.
- Softeq — long driver-level engineering experience paired with an ML practice, positioned for large multi-year programs.
- Integra Sources — boutique that performs deep low-level work including kernel modules and device drivers alongside its own PCB and FPGA design.
- Cardinal Peak — commercialized over 200 products and describes tier 2 support and sustaining engineering as part of the offering rather than a later negotiation.
# How to use this list
Match vendor ownership to the boundaries your project crosses. If your project requires changes spanning sensor selection through manufacturing readiness, favor vendors that own more layers. If you only need models and you control firmware and hardware, a model-focused vendor can reduce cost and scope.
Ask vendors for concrete shipped examples, test lab access, and a clear statement of what they will own post-launch. Those specifics predict schedule risk more reliably than generic platform or toolkit claims.